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US 9,883,166 B2Granted
Three dimensional image pick-up device and manufacturing method thereof
AssigneeLG Innotek Co., Ltd.
InventorsSangyun Oh, Seongcheol Jeong
Life of this patent
Estimating the term…
Abstract
A 3-D image pick-up device is disclosed, the device including: a PCB mounted with two camera modules including an image sensor; and a reinforcing member mounted with two exposure windows, wherein the PCB and the reinforcing member are mutually adhered to allow the camera modules of the PCB to be exposed through the exposure window of the reinforcing member.
Claims19
A 3-D image pick-up device, comprising:
- a PCB (Printed Circuit Board);
- two camera modules, the two camera modules disposed on an upper surface of the PCB;
- a reinforcing member comprising two exposure windows disposed at positions corresponding with that of the two camera modules, the reinforcing member coupled to the upper surface of the PCB;
- and
- at least one rib disposed on the reinforcing member and spaced apart from the two exposure windows,
- wherein the two camera modules comprise a first camera module and a second camera module spaced apart from each other,
- wherein the reinforcing member is configured to prevent the PCB from being bent,
- wherein a distance from the upper surface of the PCB to an upper surface of each of the two camera modules is longer than a distance from the upper surface of the PCB to an upper surface of the reinforcing member so that a first portion of a lateral surface of the first camera module is exposed outside the reinforcing member, and a second portion of a lateral surface of the second camera module is exposed outside the reinforcing member,
- wherein the first portion of the first camera module is parallel with the second portion of the second camera module, and
- wherein the first portion of the first camera module faces the second portion of the second camera module.
7 more elements
A 3-D image pick-up device, comprising:
- a PCB (Printed Circuit Board);
- two camera modules, the two camera modules discretely disposed on an upper surface of the PCB;
- a reinforcing member comprising two exposure windows correspondingly formed at positions of the two camera modules, the reinforcing member coupled to the upper surface of the PCB;
- at least one rib formed between the two exposure windows;
- and
- a connector unit disposed on the upper surface of the PCB,
- wherein the two camera modules comprises a first camera module and a second camera module spaced apart from each other,
- wherein the reinforcing member further comprises an opening disposed at a portion corresponding to a position of the connector unit disposed on the PCB,
- wherein a distance from the upper surface of the PCB to an upper surface of each of the two camera modules is longer than a distance from the upper surface of the PCB to an upper surface of the reinforcing member so that a first portion of a lateral surface of the first camera module is exposed outside the reinforcing member and a second portion of a lateral surface of the second camera module is exposed outside the reinforcing member,
- wherein the first portion of the first camera module is parallel with the second portion of the second camera module, and
- wherein the first portion of the first camera module faces the second portion of the second camera module.
8 more elements
A method for manufacturing a 3-D image pick-up device, the method comprising:
- attaching two camera modules, each camera module including an image sensor, to a PCB (Printed Circuit Board);
- coating a thermosetting epoxy on a predetermined surface of the PCB;
- temporarily coupling a reinforcing member formed with an exposure window to the PCB coated with the thermosetting epoxy;
- arranging the reinforcing member temporarily coupled PCB to a hot plate, the reinforcing member including two exposure windows correspondingly formed at positions of the two camera modules and at least one rib formed between the two exposure windows, and the reinforcing member being coupled to an upper surface of the PCB to prevent the PCB from being bent;
- and
- pressing an upper surface of the reinforcing member for coupling the reinforcing member by curing the thermosetting epoxy,
- wherein the two camera modules are discretely formed and a connector unit is mounted at an area of the PCB,
- wherein the reinforcing member is formed with an opening at a portion corresponding to a position of the connector unit mounted at the PCB, and
- wherein a distance from the upper surface of the PCB to an upper surface of each of the two camera modules is longer than a distance from the upper surface of the PCB to an upper surface of the reinforcing member so that a portion of a lateral surface of each of the two camera modules is exposed outside the reinforcing member.
6 more elements
Dependencies are inferred from the claim text.