Memory card adapter

A memory card adaptor, comprising:

• a package substrate having a first surface and a second surface, the second surface being an opposite surface of the first surface;
• a first layer on the first surface, the first layer including a plurality of contact pads, a plurality of contact lands and a conduction area, the plurality of contact pads being configured to contact a card socket directly, and the plurality of contact lands configured to be connected with the plurality of contact pads, and at least a portion of the conduction area being located between the contact pads and the contact lands, wherein the contact pads include data pads, a command pad, a clock pad, a power pad and a ground pad, wherein total pitches of the contact lands are substantially smaller than that of the contact pads;
• a second layer on the second surface, the second layer including a plurality of signal lines, each of the plurality of signal lines being connected to a corresponding contact pad and contact land respectively through a plurality of via holes, the plurality of via holes being formed to penetrate the package substrate;
• and
• a plurality of contact pins, each of the plurality of contact pins having a first end and a second end, the first end being electrically connected with a corresponding one of the contact lands and the second end being protruded from the package substrate, and the plurality of contact pins being configured to connect the plurality of contact lands with a memory card when the memory card is inserted into the memory card adaptor
• wherein the conduction area is connected to one of the power pad and the ground pad to operate as a return path for at least one of the signal lines.