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US 9,873,250 B2Granted
Microfluidic assembly with mechanical bonds
AssigneeSTMicroelectronics S.r.l.
InventorsSimon Dodd, Andrea Nicola Colecchia
Life of this patent
Estimating the term…
Abstract
Embodiments of the present disclosure are directed to a microfluidic delivery system that includes a microfluidic semiconductor die coupled to a flexible interconnect substrate to form an assembly. At least one embodiment is directed to a semiconductor die having an active surface that includes a layout that has electrically active bond pads along one side of the active surface of the die. A second side of the active surface of the die includes one or more mechanical pads.
Claims20
An assembly comprising:
- a microfluidic semiconductor die including an active surface, a plurality of electrical bond pads located on the active surface proximate a first side of the die and a plurality of mechanical bond pads on the active surface proximate a second side of the die that is opposite the first side, the mechanical bond pads being electrically decoupled from active electrical components of the die, the die including an inlet that is in fluid communication with a plurality of nozzles for expelling fluid received by the inlet;
- a flexible interconnect substrate including a through opening, the active surface of the microfluidic semiconductor die located in the through opening, the flexible interconnect substrate including a plurality of electrical contacts that extend into the through opening and a plurality of mechanical contacts that extend into the through opening;
- first conductive elements that couple the plurality of electrical bond pads of the microfluidic semiconductor die to the plurality of electrical contacts of the flexible interconnect substrate;
- and
- second conductive elements that couple the plurality of mechanical bond pads of the microfluidic semiconductor die to the plurality of mechanical contacts of the flexible interconnect substrate.
2 more elements
An assembly comprising:
- a microfluidic semiconductor die including an active surface, a plurality of electrical bond pads located on the active surface along a first side of the die and a plurality of mechanical bond pads on the active surface along a second, opposite side of the die, the mechanical bond pads being electrically decoupled from active electrical components of the die, the die including an inlet that is in fluid communication with a plurality of nozzles for expelling fluid received by the inlet;
- a flexible interconnect substrate including a through opening at a first end and a plurality of interconnect contacts at a second end, the active surface of the microfluidic semiconductor die located in the through opening, the flexible interconnect substrate including a plurality of electrical contacts that extend into the through opening and a plurality of mechanical contacts that extend into the through opening;
- first conductive elements that couple the plurality of electrical bond pads of the microfluidic semiconductor die to the plurality of electrical contacts of the flexible interconnect substrate;
- and
- second conductive elements that couple the plurality of mechanical bond pads of the microfluidic semiconductor die to the plurality of mechanical contacts of the flexible interconnect substrate.
2 more elements
An assembly comprising:
- a microfluidic semiconductor die including an active surface, a plurality of electrical bond pads located on the active surface proximate a first side of the die and a plurality of mechanical bond pads on the active surface proximate a second side of the die that is opposite the first side, the mechanical bond pads being electrically decoupled from active electrical components of the die, the die including an inlet and a plurality of nozzles, the inlet being in fluid communication with the plurality of nozzles;
- a flexible interconnect substrate including a through opening, the active surface of the microfluidic semiconductor die at the through opening of the flexible interconnect substrate, the flexible interconnect substrate including a plurality of electrical contacts and a plurality of mechanical contacts;
- first conductive elements coupling the plurality of electrical bond pads of the microfluidic semiconductor die to the plurality of electrical contacts of the flexible interconnect substrate;
- and
- second conductive elements coupling the plurality of mechanical bond pads of the microfluidic semiconductor die to the plurality of mechanical contacts of the flexible interconnect substrate.
2 more elements
Dependencies are inferred from the claim text.