Digital processing equipment

An apparatus comprising:

• a spray module comprising at least one column of spray nozzles, each spray nozzle comprising an aperture coupled to a plurality of feeds, each of the plurality of feeds supplying a different one of a plurality of processing substances to the aperture of the spray nozzle, each spray nozzle to deliver a processing substance of the plurality of processing substances through the aperture on a semiconductor substrate during a process for semiconductor manufacturing as the semiconductor substrate moves past the spray module, wherein the at least one column of spray nozzles is arranged with respect to a direction of travel of the semiconductor substrate so the semiconductor substrate passes the spray nozzles;
• a location module that identifies a location of the semiconductor substrate with respect to the spray module;
• a spray pattern module that determines a spray pattern of where the processing substance is to be delivered to the semiconductor substrate;
• and
• a nozzle control module configured to actuate each spray nozzle independently based on the spray pattern and a location of the semiconductor identified by the location module and configured to select the processing substance to be delivered to the semiconductor substrate by activating a feed of the plurality of feeds.