Integrated circuit having temperature-sensing device

An integrated circuit, comprising:

• a plurality of sensing pixels, each sensing pixel of the plurality of sensing pixels comprising:
• a sensing film portion overlying a sensing circuit, the sensing circuit comprising:
• a bio-sensing device responsive to an electrical characteristic of the sensing film portion and selectively coupled with a first signal path;
• and
• a temperature-sensing device responsive to a temperature of the sensing film portion and selectively coupled with a second signal path;
• and
• one or more heating elements coupled with one or more driving signal paths.

A method of fabricating an integrated circuit, the method comprising:

• forming a plurality of sensing circuits on a first substrate;
• bonding the plurality of sensing circuits to a second substrate;
• removing the first substrate from the plurality of sensing circuits;
• and
• forming a plurality of sensing film portions over the plurality of sensing circuits to form a plurality of sensing pixels,
• wherein
• each sensing circuit of the plurality of sensing circuits comprises:
• a bio-sensing device configured to generate a first signal responsive to an electrical characteristic of the corresponding sensing film portion;
• and
• a temperature-sensing device configured to generate a second signal responsive to a temperature of the corresponding sensing film portion, and
• each sensing pixel comprises one or more heating elements configured to adjust the temperature of the corresponding sensing film portion.