Ultrasonic matrix array probe with thermally dissipating cable and backing block heat exchange

An ultrasonic transducer probe assembly comprising:

• a probe case;
• an array of transducer elements located behind an acoustic window in the probe case and configured to transmit and receive ultrasound energy through the acoustic window;
• an integrated circuit coupled to the transducer elements in the probe case and configured to process signals transmitted or received by the array;
• a thermally conductive backing block thermally and acoustically coupled to the array of transducer elements and the integrated circuit which attenuates or scatters ultrasound energy received from the transducer elements, the thermally conductive backing block comprising a porous structure;
• a probe connector configured to connect the transducer probe to an ultrasound system;
• a cable connected between the probe case and the probe connector and containing a plurality of electrical conductors coupled between the probe case and the probe connector;
• and
• a fluid-based closed loop cooling system comprising:
• a closed fluid loop extending through the cable from the probe case to the probe connector;
• a pump, coupled to the fluid loop, which pumps fluid through the loop;
• and
• a heat exchanger which acquires heat generated by the transducer array and integrated circuit for dissipation outside the closed fluid loop,
• wherein the heat exchanger comprises a fluid channel that is coupled to the closed fluid loop and is configured to allow fluid to pass through the porous structure of the thermally conductive backing block.