Packaged integrated circuit device with cantilever structure

A device comprising:

• a first package including a first package material and one or more integrated circuit (IC) dies disposed in the first package material, wherein an exterior of the first package material forms a first side, a second side opposite the first side, and a sidewall extending between a first edge of the first side and a second edge of the second side;
• a first substrate coupled to the exterior of the first package material at the first side, wherein one of the first side and the second side is offset from a line extending from a first cantilever portion of the first substrate in a direction perpendicular to the first side, wherein the one or more IC dies are electrically coupled to the first substrate via the first side;
• circuitry disposed on the first substrate, wherein the one or more IC dies are electrically coupled to the circuitry via the first substrate, the circuitry including a circuit structure disposed on the first cantilever portion;
• a second substrate coupled to the exterior of the first package material at the second side, wherein the one or more IC dies are electrically coupled via the second substrate to a hardware interface at a surface of the second substrate;
• a circuit component mounted onto the second substrate at a region of the second substrate which is outside of the first package, the circuit component electrically coupled to the one or more IC dies via the second substrate;
• and
• a second package material disposed around each of the first package, the first substrate, the circuit structure and the circuit component, wherein the second package material adjoins the second substrate, wherein one or more interconnects, disposed in the second package material, provide electrical connection between the one or more IC dies and the second substrate.