Heat spreading in molded semiconductor packages
AssigneeAltera Corporation
InventorWilliam H Hata
Life of this patent
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Abstract
A molded semiconductor package comprises a substrate, a semiconductor die mounted on the substrate, a molding compound encircling the die on the substrate, and one or more heat conductors in the molding compound that are thermally coupled to the substrate. Advantageously, the heat conductors are mounted in the molding compound near one or more of the corners of the die. The package may also include a lid. The heat conductors produce a more uniform distribution of heat in the substrate. The package is assembled by mounting the die on the substrate, mounting the heat conductors on the substrate and applying the molding compound to the substrate, the die, and the heat conductors mounted on the substrate. For packages that use a lid, the lid is then secured to the package and coupled to the heat conductors.
Claims20
A structure comprising:
- a substrate;
- a semiconductor die mounted on the substrate, wherein the semiconductor die comprises first, second, third, and fourth corners;
- molding material encircling the semiconductor die;
- and
- first, second, third, and fourth heat conductors embedded in the molding material and extending upward from the substrate and thermally connected with the substrate, wherein the first, second, third, and fourth heat conductors are mounted on the substrate near the first, second, third, and fourth corners, respectively, of the semiconductor die.
A structure comprising:
- a substrate comprising a molded plastic and a plurality of metal layers formed in the molded plastic and on major surfaces of the substrate;
- a semiconductor die mounted on the substrate;
- molding material encircling the semiconductor die;
- first, second, third, and fourth heat conductors embedded in the molding material and extending upward from the substrate and thermally connected with the substrate, wherein the first, second, third, and fourth heat conductors are mounted on the substrate near first, second, third, and fourth corners, respectively, of the semiconductor die, and
- a lid on the molding material, wherein each of the first, second, third, and fourth heat conductors extends from the lid to the substrate.
A method for forming a semiconductor package comprising:
- mounting a semiconductor die on a substrate, wherein the semiconductor die comprises first, second, third, and fourth corners,
- mounting first, second, third, and fourth heat conductors on the substrate around the semiconductor die, and
- applying a molding material to the substrate, the first, second, third, and fourth heat conductors, and the semiconductor die, wherein the first, second, third, and fourth heat conductors are mounted on the substrate near the first, second, third, and fourth corners, respectively, of the semiconductor die.
Dependencies are inferred from the claim text.