Transponder wire bonded to round wire on adhesive tape having a water-soluble backing

A circuit arrangement, comprising:

• a water soluble backing having first and second major surfaces, the first major surface opposite the second major surface;
• a layer of pressure sensitive adhesive (PSA) having a third major surface and a fourth major surface, the third major surface opposite the fourth major surface, and the fourth major surface directly adhered to the first major surface of the water soluble backing;
• one or more metal foil pads attached directly on the third major surface of the layer of PSA;
• electrically conductive round wire attached directly on the third major surface of the layer of PSA, the wire having a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively;
• and
• an RF transponder attached directly on the third major surface of the layer of PSA and electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.