Substrate processing apparatus
AssigneeSCREEN Holdings Co., Ltd.
InventorsMasahiro Miyagi, Masanobu Sato, Hiroyuki Araki
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AssigneeSCREEN Holdings Co., Ltd.
InventorsMasahiro Miyagi, Masanobu Sato, Hiroyuki Araki
Estimating the term…
A substrate processing apparatus has a cup part for receiving processing liquid such as pure water which is splashed from a substrate. The cup part is formed of electrical insulation material or semiconductor material. Hydrophilic treatment may be performed on an outer annular surface of the cup part and water may be held on the outer annular surface of the cup part while processing the substrate. With the disclosed apparatus, charged potential of the cup part generated by splashing of pure water can be suppressed, without greatly increasing the manufacturing cost of the substrate processing apparatus. As a result, it is possible to prevent electric discharge from occurring on the substrate due to induction charging of the substrate, in application of the processing liquid onto the substrate.
A substrate processing apparatus for processing a substrate by applying processing liquid onto said substrate, comprising:
A substrate processing apparatus for processing a substrate by applying processing liquid onto said substrate, comprising:
A substrate processing apparatus for processing a substrate by applying processing liquid onto said substrate, comprising:
Dependencies are inferred from the claim text.