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AssigneeDIC Corporation
InventorsTomoyuki Imada, Yusuke Sato, Seiji Kimoto
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Provided is a compound containing a phenolic hydroxy group which has excellent heat resistance, a resist composition which has excellent thermal decomposition resistance, optical sensitivity and resolution, and a composition for a resist underlayer coating which has excellent thermal decomposition resistance and dry etching resistance. The compound containing a phenolic hydroxy group has a molecular structure represented by Structural Formula (1) below: wherein R1 is a hydrogen atom, an alkyl group or an aryl group, n is an integer of 2 to 10, R2 is any one of an alkyl group, an alkoxy group, an aryl group, an aralkyl group and a halogen atom, m is an integer of 0 to 4, and when m is 2 or greater, a plurality of R2's may be the same as or different from each other and may be bonded to either one of two aromatic rings of the naphthylene skeleton.
A calix[2-10]arene compound which is obtained by reacting a 1,6-dihydroxynaphthalene compound with formaldehyde in the presence of a basic catalyst;
A calix[2-10]arene compound which is obtained by reacting a 1,6-dihydroxynaphthalene compound with an aliphatic aldehyde compound having 2 or more carbon atoms or an aromatic aldehyde compound, in the presence of an acid catalyst;
Dependencies are inferred from the claim text.