Power supply device
AssigneeTDK Corporation
InventorAkira Ikezawa
Life of this patent
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AssigneeTDK Corporation
InventorAkira Ikezawa
Estimating the term…
As a thermal conductive material having fluidity is applied on a base plate, probability of a decrease in thermal conductive performance, i.e., probability of a decrease in a heat radiation property caused by a human work, can be suppressed in comparison with the case in which a heat transfer sheet is installed. When the thermal conductive material having fluidity is used, thermal conductive performance is obtained by applying the thermal conductive material is applied and thus reliability is improved. In addition, as stepped sections are formed at sidewalls of circumferential edges of protrusion surfaces on which the thermal conductive material is applied, even when the thermal conductive material having fluidity sticks out of the protrusion surfaces, since the thermal conductive material is accommodated in the stepped sections, the thermal conductive material is suppressed from sticking to another electronic component or the like to improve reliability.
A power supply device comprising:
A power supply device comprising:
A power supply device comprising:
Dependencies are inferred from the claim text.