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US 9,820,374 B2Granted
Use of hybrid PCB materials in printed circuit boards
AssigneeHewlett Packard Enterprise Development LP
InventorsKarl J. Bois, Ramon R. Campa
Life of this patent
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Abstract
A apparatus comprising a printed circuit board (“PCB”). The PCB comprises a first insulating layer and a second insulating layer. The first insulating layer is made of a first material and the second insulating layer is made of a second material. The first material has a lower dissipation factor than the second material. The first material and second material have substantially similar dielectric constants.
Claims17
An apparatus, comprising:
- a printed circuit board (“PCB”) comprising a first insulating layer and a second insulating layer,
- wherein the first insulating layer is made of a first material and the second insulating layer is made of a second material;
- wherein the first material has a lower dissipation factor than the second material;
- and
- wherein the first material and second material have substantially similar dielectric constants.
2 more elements
A system comprising:
- a first printed circuit board (“PCB”) subcomponent comprising a first insulating layer and a first conducting layer;
- and
- a second PCB subcomponent comprising a second insulating layer and a second conducting layer;
- wherein the first insulating layer is made from a first material and the second insulating layer is made from a second material;
- wherein the first material has a lower dissipation factor than the second material;
- and
- wherein the first material and second material have substantially similar dielectric constants.
4 more elements
Dependencies are inferred from the claim text.