Filtering lead from photoresist stripping solution

A semiconductor wafer fabrication system comprising:

• a Lead (Pb) free semiconductor wafer and a leaded semiconductor wafer within a reservoir of a photoresist stripping tool that simultaneously strips photoresist from the Pb free semiconductor wafer and the leaded semiconductor wafer, wherein Pb from the leaded semiconductor wafer corrodes into the photoresist stripping solution, the photoresist stripping tool comprising:
• the reservoir that contains a photoresist stripping solution;
• a Pb filter within the reservoir that removes Pb from the photoresist stripping solution, the Pb filter comprising a mesh filter element comprising an inner Titanium structure and Tin (Sn) specie exterior surfaces;
• and
• Pb from the photoresist stripping solution deposited upon the Sn specie exterior surfaces of the mesh filter element.