Method for making suspended elements with different thicknesses for a MEMS and NEMS structure
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorAudrey Berthelot
Life of this patent
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Abstract
Method for making a N/MEMS device including a structure provided with an active part having a first suspended element and a second suspended element with different thicknesses, the method comprising the following steps of: forming, in a first substrate (100), a sacrificial zone (105), transferring a given layer onto the sacrificial zone, defining in said given layer a first suspended element facing the first sacrificial zone, defining a second suspended element in the first substrate and said given layer, releasing at least the first suspended element.
Claims19
A method for making a structure including an active part comprising at least one first suspended element and a second suspended element having different thicknesses, the method comprising:
- forming, in a first substrate, a first sacrificial zone,
- transferring onto a first face of the first substrate a given layer extending at least on the first sacrificial zone,
- defining in said given layer at least one first suspended element on the first sacrificial zone, by forming one or more first trenches in the given layer having a bottom revealing the first sacrificial zone such that the first suspended element is formed from the given layer and is arranged to be in contact with the first sacrificial zone,
- defining at least one second suspended element by forming one or more second trenches in the first substrate and through said given layer, the second suspended element having a thickness higher than the thickness of the first suspended element, and
- releasing at least the first suspended element by removing at least the first sacrificial zone.
A method for making a structure including an active part comprising at least one first suspended element and a second suspended element having different thicknesses, the method comprising:
- forming, in a first substrate, a first sacrificial zone,
- transferring onto a first face of the first substrate a given layer extending at least on the first sacrificial zone,
- defining in said given layer at least one first suspended element on the first sacrificial zone, by forming one or more first trenches in the given layer having a bottom revealing the first sacrificial zone such that the first suspended element is formed from the given layer,
- defining at least one second suspended element by forming one or more second trenches in the first substrate and through said given layer, the second suspended element having a thickness higher than the thickness of the first suspended element, and
- releasing at least the first suspended element by removing at least the first sacrificial zone.
A method for making a structure including an active part comprising at least one first suspended element and a second suspended element having different thicknesses, the method comprising:
- forming, in a first substrate, a first sacrificial zone,
- transferring onto a first face of the first substrate a given layer extending at least on the first sacrificial zone,
- defining in said given layer at least one first suspended element on the first sacrificial zone, by forming one or more first trenches in the given layer having a bottom revealing the first sacrificial zone,
- defining at least one second suspended element by forming one or more second trenches in the first substrate and through said given layer, the second suspended element having a thickness higher than the thickness of the first suspended element, and
- releasing at least the first suspended element by removing at least the first sacrificial zone,
- after forming the first sacrificial zone, transferring a second substrate either onto a second face of the first substrate, or on the given layer,
- wherein the first sacrificial zone is formed by making at least one blind hole through the first or the second face respectively of the first substrate and then filling the hole with at least one first material, the method further comprising, after the transferring the second substrate respectively onto the given layer or onto the first substrate and prior to forming the second suspended element, thinning respectively the second face or the first face of the first substrate so as to remove a thickness of the first substrate which is located on the side opposite to the face from which the blind hole is made, the thinning being continued until the first sacrificial zone is reached, the first sacrificial zone acting subsequently as an etching stop zone.
Dependencies are inferred from the claim text.