Package structure of electronic device

A package structure of an electronic device, comprising:

• a first substrate, comprising a first light-transmitting portion and a periphery portion surrounding the first light-transmitting portion;
• a second substrate, comprising a second light-transmitting portion, two covering portions located on two opposite sides of the second light-transmitting portion and an extending portion, the first light-transmitting portion and the second light-transmitting portion being disposed correspondingly, and a device disposition region being disposed therebetween, wherein the covering portions cover the periphery portion of the first substrate located on two opposite sides of the first light-transmitting portion and cover two opposite side surfaces of the first substrate, the extending portion is connected with the covering portions and covers an outer surface of the first substrate, and the extending portion and the covering portions are integrally formed;
• an electronic device, disposed on the first substrate or the second substrate and located in the device disposition region;
• and
• a first barrier structure, disposed on the first substrate or the second substrate, wherein the first barrier structure is disposed corresponding to the periphery portion and located on at least one side of the device disposition region.