Test structure for monitoring liner oxidation
AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsWanbing Yi, Daxiang Wang, Juan Boon Tan, Kemao Lin, Shaoqiang Zhang
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Abstract
Embodiments of a method for forming a device using test structures are presented. The method includes providing a wafer with a device layer. The device layer includes a main device region and a perimeter region. The device layer is patterned with active and test patterns. Test patterns include dummy patterns disposed in a test device area. The wafer is processed to form at least one test device disposed in the perimeter region and one or more active devices disposed in the main device region. The test device determines a design window of the one or more active devices. Additional processing is performed to complete forming the device.
Claims21
A method of forming a device comprising:
- providing a wafer, the wafer comprises a device layer having a main device region and a perimeter region;
- patterning the device layer with active and test patterns, wherein the test pattern comprises dummy patterns disposed in a test device area;
- processing the wafer, wherein the process forms
- at least one test device disposed in the perimeter region, wherein the test device comprises a resistor which includes a resistive element with first and second resistor ends,
- and one or more active devices disposed in the main device region, wherein the test device determines a design window of the one or more active devices;
- and
- performing additional processing to complete forming the device.
A method of forming a device comprising:
- providing a substrate with a device layer;
- forming a resist layer on the device layer;
- providing a patterned reticle comprising active and test patterns corresponding to active and test devices, the test device determines a design window of the active device, wherein
- the active patterns are disposed in a device region and the test patterns are disposed in a frame region, the frame region surrounds the device region,
- the test patterns comprise a filled region filled with dummy structures,
- the filled region surrounds an empty region devoid of dummy structures, and
- the empty region surrounds an innermost region comprising a resistor, the resistor comprises a resistive element with first and second resistor ends;
- patterning the resist layer using the reticle to form a patterned resist layer containing active and test patterns of the reticle;
- performing an etch to pattern the device layer using the patterned resist layer;
- and
- performing additional processing to complete forming the device.
A device comprising:
- a wafer having active patterns disposed on a wafer substrate, wherein the active patterns are defined by a design window, the design window is determined by a test structure, wherein
- the test structure comprises a filled region filled with dummy structures,
- the filled region surrounds an empty region devoid of dummy structures,
- the empty region surrounds an innermost region comprising a resistor having a designed resistance, and
- a pairing of the empty region and filled region determines the design window.
Dependencies are inferred from the claim text.