Wafer holder and temperature conditioning arrangement and method of manufacturing a wafer

A wafer holder and temperature conditioning arrangement to be mounted to a vacuum wafer treatment chamber, comprising:

• a base arrangement mounted to a wall of the vacuum wafer treatment chamber, said base arrangement having an essentially planar surface the outer periphery thereof being bordered by a protruding circular rim surface about a center of said essentially planar surface, wherein said essentially planar surface and said protruding circular rim surface are heat reflector surfaces;
• a metal circular wafer carrier plate centrally mounted with respect to said center of said essentially planar surface, said metal circular wafer carrier plate being drivingly rotatable about a geometric axis through said center of said essentially planar surface with respect to said base arrangement, said protruding circular rim surface curving outwards and upwards away from said essentially planar surface toward a bottom surface of said metal circular wafer carrier plate;
• a heater compartment commonly defined by the bottom surface of said metal circular wafer carrier plate, said essentially planar surface, and said protruding circular rim surface, the heater compartment comprising a multitude of heater tubes mounted to said base arrangement between said essentially planar surface and said bottom surface of said metal circular wafer carrier place, said heater tubes being directly exposed to said bottom surface of said metal circular wafer carrier plate and to said essentially planar surface of said base arrangement;
• and
• a wafer retaining arrangement operationally coupled to said metal circular wafer carrier plate.