US 9,793,111 B2Granted

Spin coating method and manufacturing method of electronic component

AssigneeToshiba Memory Corporation

InventorKeisuke Nakazawa

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Abstract

A spin coating method according to an embodiment includes forming a first material film on an underlying material. The underlying material is rotated while a solution of a second material film is supplied onto an upper surface of the first material film to make the solution stay on the upper surface of the first material film. Rotating of the underlying material is stopped or a rotational speed of the underlying material is reduced to 10 rpm or less. The underlying material is rotated after a first period elapses after the stopping of the rotating of the underlying material, or the rotational speed of the underlying material is increased after the first period elapses after the reducing of the rotational speed of the underlying material to spin off the solution from the upper surface of the first material film.

Claims16

Dependent claims

A spin coating method comprising:

forming a first material film on an underlying material;
rotating the underlying material while a solution of a second material film is supplied onto an upper surface of the first material film, to make the solution stay on the upper surface of the first material film;
stopping the rotating of the underlying material or reducing a rotational speed of the underlying material to 10 rpm or less;
and
spinning off the solution from the upper surface of the first material film by rotating the underlying material after a first period elapses after the stopping of the rotating of the underlying material, or by increasing the rotational speed of the underlying material after the first period elapses after the reducing of the rotational speed of the underlying material,
wherein when the solution is spun off, the solution is supplied onto the upper surface of the first material film, the supplying of the solution is stopped and rotation is then performed for a certain period of time, and thereafter the solution is spun off.

3 more elements

A manufacturing method of an electronic component, comprising:

forming a first material film on an underlying material;
rotating the underlying material while a solution of a second material film is supplied onto an upper surface of the first material film, to make the solution stay on the upper surface of the first material film;
stopping the rotating of the underlying material or reducing a rotational speed of the underlying material to 10 rpm or less;
and
spinning off the solution on the upper surface of the first material film by rotating the underlying material or increasing the rotational speed of the underlying material after a first period elapses after the stopping of the rotating of the underlying material, or after the first period elapses after the reducing of the rotational speed of the underlying material,
wherein when the solution is spun off, the solution is supplied onto the upper surface of the first material film, the supplying of the solution is stopped and rotation is then performed for a certain period of time, and thereafter the solution is spun off.

3 more elements

Dependencies are inferred from the claim text.