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US 9,771,305 B2Granted
Sintering apparatus, method of manufacturing sintered compact, and target material
AssigneeSony Semiconductor Solutions Corporation
InventorKiwamu Adachi
Life of this patent
Estimating the term…
Abstract
A sintering apparatus includes: a non-transportable section mounted in the atmosphere; a transportable section that has a mold capable of accommodating a material to be processed and is loaded detachably with respect to the non-transportable section; and a covering member that envelops the transportable section loaded on the non-transportable section in an almost hermetically sealed state and allows the transportable section to be separated from the non-transportable section with the transportable section enveloped in the almost hermetically sealed state.
Claims15
A sintering apparatus, comprising:
- a non-transportable section mounted exposed to the atmosphere;
- a transportable section that has a mold capable of accommodating a material to be processed and is loaded detachably with respect to the non-transportable section;
- and
- a covering member that, separately of the transportable section, envelops the transportable section, including the mold, in an almost hermetically sealed state and allows the transportable section and covering member to be jointly separated from the non-transportable section with the transportable section and the mold enveloped in the almost hermetically sealed state.
1 more element
Dependencies are inferred from the claim text.