Assemblies having shield lines of an upper wiring level electrically coupled with shield lines of a lower wiring level
AssigneeMicron Technology, Inc.
InventorMakoto Sato
Life of this patent
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AssigneeMicron Technology, Inc.
InventorMakoto Sato
Estimating the term…
Some embodiments include an assembly having a first wiring level with a plurality of first shield lines and first signal lines. The first shield lines and first signal lines have first segments extending along a first direction and second segments extending along the first direction and laterally offset from the first segments. The assembly includes a second wiring level below the first wiring level and having a plurality of second shield lines and second signal lines. The second shield lines and second signal lines have third segments extending along the first direction and fourth segments extending along the first direction and laterally offset from the third segments. The fourth segments of the second shield lines extend to under the first segments of the first shield lines and are electrically coupled to the first segments of the first shield lines through vertical interconnects.
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Dependencies are inferred from the claim text.