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US 9,753,371 B2Granted
Edge bead removal apparatus
AssigneeSemiconductor Manufacturing International (Shanghai) Corporation
InventorsYang Liu, Qiang Wu
Life of this patent
Estimating the term…
Abstract
An edge bead removal apparatus is provided. The edge bead removal apparatus includes a clamping unit configured to clamp a cylindrical reticle and cause the cylindrical reticle to incline with a pre-determined angle and to rotate around a central axis. The edge bead removal apparatus also includes an edge bead removal solvent nozzle configured to spray an edge bead removal solvent to remove edge beads on both edges of the cylindrical reticle.
Claims13
An edge bead removal apparatus, comprising:
- a clamping unit configured to clamp a cylindrical reticle and cause the cylindrical reticle to incline with a non-zero pre-determined angle and to rotate around a central axis, the cylindrical reticle comprising a photoresist layer on a middle portion of an outer circumferential surface of the cylindrical reticle;
- and
- an edge bead removal solvent nozzle configured to spray an edge bead removal solvent to remove edge beads on two end edges of the outer circumferential surface of the cylindrical reticle, the two end edges of the outer circumferential surface oppositely located adjacent to the photoresist layer.
Dependencies are inferred from the claim text.