Display device
AssigneeJapan Display Inc.
InventorTomokazu Saitou
Life of this patent
Estimating the term…
Abstract
In a display device that a terminal of a display panel is connected to bumps of the driver IC via an ACF, the driver IC includes input-side and output-side bump arrays arranged along mutually facing long sides. In configurations of the driver IC, a width A of a short side thereof ≧1.45 mm, a thickness thereof B ≦0.20 mm, a dimension C between input-side and output-side bumps ≧1.10 mm, a length D of each bump ≧98 μm, a minimum dimension F between the bumps ≦15 μm, a number of arrays G of the output-side bump ≧2 (two arrays) and a particle size E of a conductive particle contained in the anisotropic conductive film ≦3.5 μm, not more than six configurations are included.
Claims5
A display device, comprising:
- a display panel;
- and
- a rectangular driver IC connected to the display panel via an anisotropic conductive film,
- wherein the driver IC has an input-side bump array and an output-side bump array along mutually facing long sides, and
- in configurations listed as follows as seven items of
- (1) a width A of a short side of the driver IC ≧1.45 mm,
- (2) a thickness B of the driver IC ≦0.20 mm,
- (3) a dimension C between input-side and output-side bumps of the driver IC ≧1.10 mm,
- (4) a length D of each bump of the driver IC ≧98 μm,
- (5) a particle size E of a conductive particle contained in the anisotropic conductive film ≦3.5 μm,
- (6) a minimum dimension F between the bumps of the driver IC ≦15 μm and
- (7) a number of arrays G of the output-side bumps of the driver IC ≧2 (two arrays), six configurations are included and more than six configurations are not included.
Dependencies are inferred from the claim text.