System and method for optical input/output arrays
AssigneeHuawei Technologies Co., Ltd.
InventorDritan Celo
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AssigneeHuawei Technologies Co., Ltd.
InventorDritan Celo
Estimating the term…
System and method embodiments are provided for optical I/O arrays for wafer scale testing. A wafer includes a plurality of dies of PIC chips. Each die includes a plurality of first and second optical I/O elements each configured to couple to a testing probe array. A row of I/O elements includes alternating ones of the first and second optical I/O elements. Each die also includes a first waveguide and a second waveguide coupling a first one of the first and second optical I/O elements to a second one of the first and second optical I/O elements, respectively. The first and second optical I/O elements configured such that the testing probe array couples to at least some of the first optical I/O elements from a first side of the PIC chip and couples to at least some of the second optical I/O elements from a second side of the PIC chip.
A wafer, comprising:
A wafer, comprising:
Dependencies are inferred from the claim text.