Light source unit, method of fabricating the light source unit and backlight assembly including the light source unit

A method of fabricating a light source unit, comprising:

• placing an LED package, which includes an LED chip emitting light and a package mold having a receiving groove which receives the LED chip, on a circuit board;
• inserting a mold member onto the LED package to directly contact a top surface of the LED package;
• and
• inserting a wavelength conversion member, which converts the wavelength of light emitted from the LED chip, into the mold member,
• wherein the mold member includes a first opening disposed between the circuit board and the wavelength conversion member, the first opening accommodating the LED package therein, and a second opening disposed between the first opening and the wavelength conversion member and extended from the first opening, and
• wherein a side surface of the second opening and a side surface of the receiving groove are disposed on a same plane.

A backlight assembly, comprising:

• a light source unit configured to emit light;
• and
• a container configured to accommodate the light source unit therein,
• wherein the light source unit comprises:
• a circuit board configured to be disposed on the container;
• an LED package configured to be disposed on the circuit board and including an LED chip emitting light and a package mold having a receiving groove which receives the LED chip;
• a wavelength conversion member configured to be disposed on the LED package and convert the wavelength of light emitted from the LED chip;
• and
• a mold member configured to be interposed between the LED package and the wavelength conversion member and support the wavelength conversion member,
• wherein the mold member directly contacts a top surface of the LED package,
• wherein the mold member includes a first opening disposed between the circuit board and the wavelength conversion member, the first opening accommodating the LED package therein, and a second opening disposed between the first opening and the wavelength conversion member and extended from the first opening, and
• wherein a side surface of the second opening and a side surface of the receiving groove are disposed on a same plane.