Parallelism adjusting device and parallelism adjusting method

A parallelism adjusting device for adjusting the parallelism between a surface of a semiconductor and a surface of an electrode which is in contact with the surface of the semiconductor to press the surface of the electrode and apply a current, the parallelism adjusting device comprising

• a pressing body which allows the surface of the electrode to be inclined so as to follow the inclination of the surface of the semiconductor and presses the electrode on to the semiconductor to be electrified when the surface of the semiconductor and the surface of the electrode are in contact with each other,
• wherein the surface of the electrode has a quadrangular shape,
• wherein the pressing body has a plurality of elastic bodies which relatively come close to the surface of the semiconductor in a simultaneous manner,
• wherein the plurality of elastic bodies include first elastic bodies which are arranged in a distributive way, at a back surface side of the electrode, corresponding to four corners of the surface of the electrode, and second elastic bodies other than the first elastic bodies,
• wherein the first elastic bodies firstly come in contact with the back surface side of the electrode, and after allowing the surface of the electrode to be inclined, the second elastic bodies come in contact with the back surface side of the electrode, and press the electrode with a pressing force which is stronger than a pressing force of the first elastic bodies,
• wherein the pressing body includes a plurality of elastic bodies which are compressed to allow the surface of the electrode to be inclined so as to follow the inclination of the surface of the semiconductor when the surface of the semiconductor and the surface of the electrode are in contact with each other,
• wherein a portion of the elastic bodies are in contact with the electrode to press the electrode with the predetermined pressing force before the surface of the semiconductor and the surface of the electrode come into contact with each other, and
• wherein the other elastic bodies are in contact with the electrode to press the electrode with a pressing force which is stronger than the predetermined pressing force after the surface of the semiconductor and the surface of the electrode come into contact with each other.