Humidity sensor with void within interconnect and method of manufacturing the same

A method of manufacturing a humidity sensor comprising:

• disposing a first interlayer insulating layer on a substrate;
• disposing first and second metal electrodes adjacent to each other and on a surface of the first interlayer insulating layer;
• disposing a first etch stop layer covering the first interlayer insulating layer, and the first and second metal electrodes;
• disposing a second interlayer insulating layer on the first etch stop layer;
• disposing a passivation layer on the second interlayer insulating layer;
• forming voids within the second interlayer insulating layer;
• and
• depositing the humidity sensing material in the voids.

A humidity sensor comprising:

• a first insulating layer disposed on a substrate;
• interconnect conductors disposed on the first interlayer insulating layer;
• an etch stop layer contacts the first interlayer insulating layer and a portion of the interconnect conductors;
• a second insulating layer disposed on the etch stop layer;
• voids formed within the second insulating layer;
• and
• a humidity sensing material deposited in the voids.