Resistively heated shape memory polymer device

An apparatus comprising:

• a conductive substrate including a resistive medium;
• a first shape memory polymer (SMP) coating the conductive substrate;
• a first conductive material member coating the first SMP coated conductive substrate;
• a second SMP coating the first conductive material member coated first SMP coated conductive substrate;
• and
• first and second electrical leads;
• wherein a portion of the conductive substrate is exposed and a portion of the first conductive material member is exposed;
• wherein the first electrical lead is coupled to the exposed portion of the conductive substrate and the second electrical lead is coupled to the exposed portion of the first conductive material member;
• wherein (a) the first SMP directly contacts the first conductive material member;
• (b) the conductive substrate directly contacts the first SMP, and (c) the first conductive material member directly contacts the second SMP.