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US 9,752,006 B2Granted
Polyamide resin composition and molded article
AssigneeAsahi Kasei Kabushiki Kaisha
InventorsTeruaki Sakuma, Kazunori Terada
Life of this patent
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Abstract
A polyamide resin composition including a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and a secondary amine compound (D).
Claims10
A polyamide resin composition comprising:
- a polyamide resin (A) in 64.05 to 99.86% by mass with respect to 100% by mass of the polyamide resin composition,
- a copper compound (B) in 0.03 to 0.1% by mass with respect to 100% by mass of the polyamide resin composition, wherein the copper compound (B) is a copper halide compound,
- a bromide of an alkali metal (C) in 0.05 to 5% 0.17 to 0.6% by mass with respect to 100% by mass of the polyamide resin composition, and
- a secondary amine compound (D) comprising an aromatic secondary amine compound in 0.1 to 0.2% by mass with respect to 100% by mass of the polyamide resin composition,
- wherein the mass ratio of the bromide of an alkali metal (C) to the secondary amine compound (D) in the polyamide resin composition is 50/1 to 1/50.
2 more elements
Dependencies are inferred from the claim text.