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US 9,751,989 B2Granted
Condensation curable resin composition and semiconductor package
AssigneeShin-Etsu Chemical Co., Ltd.
InventorTakayuki Kusunoki
Life of this patent
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Abstract
A condensation curable resin composition comprising a silphenylene oligomer skeleton-bearing organosilicon compound having at least two hydroxyl and/or alkoxy groups per molecule cures into a product having both a satisfactory hardness and crack resistance.
Claims8
A condensation curable resin composition comprising (A) a silphenylene oligomer skeleton-bearing organosilicon compound having at least two hydroxyl and/or alkoxy groups per molecule, represented by the general formula (1):
- (R13SiO0.5)a(R12SiO)b(R1SiO1.5)c(SiO2)dZe(O0.5R2)f (1)
- wherein R1 is independently hydrogen or a C1-C12 unsubstituted monovalent hydrocarbon group free of aliphatic unsaturation,
- Z is independently a group having the formula (2):
- wherein R3 is independently a C1-C12 unsubstituted monovalent hydrocarbon group free of aliphatic unsaturation, and n is an integer of 1 to 3,
- R2 is independently hydrogen or a C1-C6 alkyl group,
- a is an integer of 0 to 500, b is an integer of 0 to 5,000, c is an integer of 0 to 500, d is an integer of 0 to 500, e is an integer of 1 to 500, and f is an integer of 2 to 100.
3 more elements
Dependencies are inferred from the claim text.