Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition

A photosensitive resin composition comprising:

• (a) a polyimide precursor comprising
• (a1) a structural unit represented by a general formula (1) in a ratio of 50 mol % or more based on total structural units, and
• (a2) a structural unit represented by a general formula (4),
• wherein A is a tetravalent organic group represented by a formula (2a), a tetravalent organic group represented by a formula (2b), or a tetravalent organic group represented by a general formula (2c),
• B is a divalent organic group represented by a general formula (3), and
• R1 and R2 are independently a hydrogen atom or a monovalent organic group,
• wherein X and Y are independently a divalent group that is not conjugated with benzene rings bonded thereto, or a single bond,
• wherein R3 to R10 are independently a hydrogen atom or a monovalent group, at least one of R3 to R10 being a trifluoromethyl group,
• wherein D is a tetravalent organic group represented by a general formula (5), and B, R1 and R2 are the same as defined above in connection with the general formula (1), and
• wherein Z is an ether bond (—O—) or a sulfide bond (—S—);
• (b) a compound that generates radicals when irradiated with active rays;
• (c) a solvent;
• and
• (d) a tetrazole, a tetrazole derivative, benzotriazole, or a benzotriazole derivative.