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US 9,751,751 B2Granted
Micromechanical component and method for manufacturing same
AssigneeRobert Bosch GmbH
InventorsJochen Reinmuth, Johannes Classen
Life of this patent
Estimating the term…
Abstract
A micromechanical component includes a sensor chip and a cap chip connected to the sensor chip. A cavity is formed between the sensor chip and the cap chip. The sensor chip has a movable element situated in the cavity. The cap chip has a wiring level containing an electrically conductive electrode. The cap chip has a getter element situated in the cavity.
Claims10
A micromechanical component, comprising:
- a sensor chip;
- and
- a cap chip connected to the sensor chip;
- wherein:
- a cavity is formed between the sensor chip and the cap chip,
- the sensor chip has a movable element situated in the cavity,
- the cap chip has a wiring level including an electrically conductive electrode,
- the cap chip has a getter element situated in the cavity,
- the getter element is electrically conductively connected to the electrode, and
- the getter element is configured to excite movement of the movable element.
7 more elements
A method for manufacturing a micromechanical component, comprising:
- providing a sensor chip with a movable element;
- providing a cap chip with a wiring level, including an electrically conductive electrode;
- arranging a getter element on the cap chip;
- and
- connecting the sensor chip to the cap chip in such a way that a cavity is formed between the sensor chip and the cap chip, the movable element and the getter element being situated in the cavity, wherein the getter element is electrically conductively connected to the electrode, and wherein the getter element is configured to excite movement of the movable element.
2 more elements
Dependencies are inferred from the claim text.