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US 9,751,298 B2Granted
Cutting apparatus, cutting method, and printing apparatus
AssigneeSeiko Epson Corporation
InventorsNaohiro Ueyama, Naoto Hayakawa
Life of this patent
Estimating the term…
Abstract
A cutting apparatus includes a cutting blade that cuts a medium and a casing that holds the cutting blade. The casing has a first passageway in which the medium passing through contacts the cutting blade and a second passageway in which the medium passing through does not contact the cutting blade.
Claims4
A cutting apparatus comprising:
- a cutting blade that cuts a medium;
- a casing that holds the cutting blade and that has a first passageway in which the medium passing through contacts the cutting blade and a second passageway in which the medium passing through does not contact the cutting blade;
- and
- a guide portion that is displaceable to a first position in which the guide portion allows the medium to pass through the first passageway and a second position in which the guide portion guides the medium to the second passageway, wherein the guide portion is displaced from the second position to the first position by the medium passing through the first passageway and contacting the guide portion.
1 more element
Dependencies are inferred from the claim text.