Thermal interface device

A system, comprising:

• an enclosure having first and second exterior surfaces and encapsulating a plurality of particles formed of a material having substantial bulk thermal conductivity of at least one watt per meter-Kelvin (1 W/[mK]) at a standardized measurement temperature of about 68° F. and being dispersed in a matrix material;
• and
• a first object having a first object surface and a second object having a second object surface, the enclosure being located between the objects with the first exterior surface of the enclosure facing toward the first object surface and with the second exterior surface of the enclosure facing toward the second object surface;
• wherein the enclosure has through-pores communicating between an interior of the enclosure and an exterior of the enclosure, at least a portion of the plurality of particles having diameters being larger than a maximum diameter of the through-pores.

A method, comprising:

• providing an enclosure encapsulating a plurality of particles formed of a material having substantial bulk thermal conductivity of at least one watt per meter-Kelvin (1 W/[mK]) at a standardized measurement temperature of about 68° F. and being dispersed in a matrix material, the enclosure having through-pores communicating between an interior of the enclosure and an exterior of the enclosure and at least a portion of the plurality of particles having diameters being larger than a maximum diameter of the through-pores;
• providing a first object having a first surface and a second object having a second surface;
• placing the enclosure between the first and second surfaces;
• pressing the first and second surfaces together, causing the enclosure to be deformed, thereby causing at least a portion of the matrix material to escape from the enclosure while retaining at least a portion of the plurality of particles within the enclosure.