Card de-bowing mechanism

A substrate processing system, comprising:

• a substrate transport mechanism that transports a substrate through the substrate processing system in a substrate transport direction along a substrate travel path;
• a lamination mechanism disposed along the substrate travel path, the lamination mechanism is configured to apply a laminate to the substrate;
• a substrate de-bowing mechanism disposed along the substrate travel path, the substrate de-bowing mechanism has an axial footprint, measured between a pair of movable card contact members at a first home position and that are used to de-bow the substrate, the pair of movable card contact members are disposed on a first side of the substrate travel path when at the first home position and are rotatably movable to a second home position on a second side of the substrate travel path;
• and
• the substrate de-bowing mechanism further includes a stationary card contact member disposed on the second side of the substrate travel path midway along the axial footprint, the stationary card contact member is not movable toward or away from the substrate travel path.