Acoustic wave device and method of fabricating the same

An acoustic wave device comprising:

• a support substrate made of alumina;
• a piezoelectric substrate located on the support substrate so that a surface of an outer peripheral portion of the support substrate is exposed;
• an excitation electrode located on the piezoelectric substrate and exciting an acoustic wave;
• and
• a cap substrate located on the support substrate and the piezoelectric substrate and made of an inorganic insulating material, wherein
• the cap substrate includes a first region located along an outer peripheral portion of the cap substrate, a second region located along an inside of the first region and having a thickness less than a thickness of the first region, and a third region located inside the second region and having a thickness less than a thickness of the second region, and
• a surface of the first region is bonded to the surface of the outer peripheral portion of the support substrate, a surface of the second region is bonded to a surface of an outer peripheral portion of the piezoelectric substrate, and a surface of the third region is located away from a surface of the piezoelectric substrate to form a space for the excitation electrode to vibrate.

A method of fabricating an acoustic wave device comprising:

• providing a piezoelectric substrate on a support substrate made of sapphire, alumina, or silicon so that a surface of an outer peripheral portion of the support substrate is exposed;
• providing an excitation electrode on the piezoelectric substrate, the excitation electrode exciting an acoustic wave;
• forming a first region, a second region, and a third region in a cap substrate made of an inorganic insulating material, the first region being located along an outer peripheral portion of the cap substrate, the second region being located along an inside of the first region and having a thickness less than a thickness of the first region, and the third region being located inside the second region and having a thickness less than a thickness of the second region;
• and
• sealing the excitation electrode by the cap substrate by bonding a surface of the first region to the surface of the outer peripheral portion of the support substrate, bonding a surface of the second region to a surface of an outer peripheral portion of the piezoelectric substrate, and locating a surface of the third region away from a surface of the piezoelectric substrate to form a space for the excitation electrode to vibrate.