Apparatus for substrate double-surface hole-filling
AssigneesNanchang O-Film Tech. Co., Ltd., Shenzhen O-Film Tech Co., Ltd., Suzhou O-Film Tech Co., Ltd.
InventorsSheng Zhang, Yulong Gao
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AssigneesNanchang O-Film Tech. Co., Ltd., Shenzhen O-Film Tech Co., Ltd., Suzhou O-Film Tech Co., Ltd.
InventorsSheng Zhang, Yulong Gao
Estimating the term…
The present invention provides a substrate double-surface hole-filling apparatus for carrying out a hole-filling operation on a substrate which has a first surface and a second surface, comprises a first feeding device, a first scraping device, a first drying device, a second feeding device, a second scraping device, a second drying device and a turnover device. The substrate double-surface hole-filling apparatus has a turnover device turning over the substrate which needs to be carried out with hole-filling operation. Therefore, the substrate double-surface hole-filling apparatus can automatically carry out the hole-filling operation on two surfaces of the substrate without manual turnover of the substrate, thus improving production efficiency.
A substrate double-surface hole-filling apparatus for carrying out a hole-filling operation on a substrate, comprising:
Dependencies are inferred from the claim text.