Selectably attachable buffing pad

Abstract

A selectively attachable buffer pad for using as an attachment to a conventional drill to buff or polish surfaces includes an attachment member which defines an elongated, rigid shank which is sized and shaped to be secured in the chuck of a conventional drill, a padded layer defining a planar body with a circular shape which is constructed out of a deformable material, and a buffer layer defining a conventional soft fiber buffing pad. Advantageously, the deformable nature of the padded layer enables selectively attachable buffer pad to transfer rotation from the attachment member to the buffer layer while also providing shock absorption. Thus, a conventional drill which is not otherwise suit for buffing or polishing is configured to accomplish the same through its attachment to the selectively attachable buffer pad.

Dependencies are inferred from the claim text.