Metal-insulator transition (MIT) device molded by clear compound epoxy
AssigneeElectronics and Telecommunications Research Institute
InventorsHyun-Tak Kim, Bongjun Kim, Jong Chan Park
Life of this patent
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Abstract
The inventive concept provides MIT devices molded by clear compound epoxy and fire detecting devices including the MIT device. The fire detecting device is supplied with a power source from a power control device. The fire detecting device includes a MIT device including a MIT chip molded by a clear compound epoxy, a diode bridge circuit supplied with the power source from the power control device for providing a non-polar power source, a notice circuit supplied with the non-polar power source from the diode bridge circuit for warning of a fire alarm in response to a detecting signal from the MIT device, and a stabilization circuit for maintaining the detecting signal for a certain period.
Claims10
A metal-insulator transition (MIT) device comprising:
- a MIT chip having a material causing a metal-insulator transition (MIT) phenomenon at a critical temperature;
- and
- a clear compound epoxy which molds the MIT chip,
- wherein:
- the clear compound epoxy forms a clear compound epoxy layer including an inner surface which covers and faces the MIT chip and an outer surface which faces an exterior;
- and
- the MIT chip and the clear compound epoxy layer are formed into a package, such that the clear compound epoxy layer is an outer layer of the package, defining the package as a separate device from the exterior.
A metal-insulator transition (MIT) device comprising:
- a MIT chip having a material causing a metal-insulator transition (MIT) phenomenon at a critical temperature;
- a clear compound epoxy which molds the MIT chip;
- a first terminal connected to the MIT chip for receiving a signal;
- a second terminal connected to the MIT chip for output a signal;
- and
- a third terminal allowing external heat transfer and electrically insulated.
A metal-insulator transition (MIT) device comprising:
- a MIT chip having a material causing a metal-insulator transition (MIT) phenomenon at a critical temperature;
- a clear compound epoxy which molds the MIT chip, the clear compound epoxy forming a first epoxy layer including an inner surface which covers and faces the MIT chip and an outer surface;
- and
- a second epoxy layer which covers and molds the first epoxy layer,
- wherein the second epoxy layer is formed of a clear compound epoxy or a colored compound epoxy, and
- wherein the second epoxy layer includes an inner surface which covers and faces the first epoxy layer and an outer surface which faces an exterior;
- and
- the MIT chip and the first and second epoxy layers are formed into a package, such that the second epoxy layer is an outer layer of the package, defining the package as a separate device from the exterior.
Dependencies are inferred from the claim text.