Adhesives suitable for use in bonding applications

An article comprising an adhesive layer, comprising:

• i) at least one halogenated polyolefin having a weight average molecular weight of 200,000 to 400,000, wherein the halogen content ranges from 55 to 90 percent by weight, present in an amount in the range of 1 to 30 wt.-%, based on the weight of the adhesive;
• ii) at least one epoxysilane having at least one terminal alkoxy silane group wherein the epoxysilane is present in an amount of 0.2 to 5 wt.-%, based on the weight of the adhesive;
• iii) at least one bis-silane, wherein the bis-silane has two silicon atoms per molecule, wherein the two silicon atoms are linked with each other by a divalent linkage group and each silicon atom carries three additional substituents, wherein at least one of the three additional substituents is an alkyl or alkoxy residue, and the bis-silane is present in an amount of 0.1 to 2 wt.-%, based on the weight of the adhesive;
• iv) optionally at least one organic solvent, wherein the weight ratio of epoxysilane to bis-silane in the adhesive is from 1:0.2 to 1:0.8 wherein the adhesive layer is, disposed between (a) a polar elastomeric substrate selected from the group consisting of nitrile butadiene rubber, hydrogenated nitrile butadiene rubber and ethylene acrylic elastomers, and (b) a metallic substrate.