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US 9,633,795 B2Granted
Electronic component and method for manufacturing electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorTomoyuki Ashimine
Life of this patent
Estimating the term…
Abstract
An electronic component that includes a resistive element. A Ni concentration of a resistive thin film of the resistive element at a side where there is a connection interface with a connection electrode is higher than the concentration of Ni at the side opposite to the interface.
Claims18
A resistive element comprising:
- a resistive film having Ni, Cr and Si as main components thereof;
- and
- a connection electrode electrically connected to the resistive film, the connection electrode having Ni as a main component,
- wherein a first Ni concentration in the resistive film at a first side thereof having a connection interface with the connection electrode is higher than a second Ni concentration at a second side opposite to the first side.
1 more element
A method of manufacturing a resistive element, the method comprising:
- forming a resistive film by vapor depositing a mixture having Ni, Cr and Si as main components onto a resin layer;
- forming a connection electrode on the resistive film, the connection electrode having Ni as a main component;
- and
- causing the vapor deposited material to evaporate or sublimate using an evaporation source such that a first Ni concentration in the resistive film at a first side thereof having a connection interface with the connection electrode is higher than a second Ni concentration at a second side opposite to the first side.
1 more element
Dependencies are inferred from the claim text.