Packaging having a surrounding heat barrier
AssigneeRep IP AG
InventorsNico Ros, Richard Ettl
Life of this patent
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Abstract
In an insulating element (1) for bounding spaces to be thermally insulated, e.g. for transport or packaging containers, comprising an in particular plate-shaped substrate element (2) made of a material having a low thermal conductivity, such as a polymer, the substrate element (2) is provided with a metallic coating (3) having a low emissivity in order to reduce the thermal radiation, yet is applied in a layer thickness of <80 nm, preferably <50 nm, such that the thermal conduction of the metallic coating will only insignificantly reduce the thus optimized insulating value. The metallic coating in the nanometer range does not only reduce the thermal radiation, but also enables optimal gas tightness with minimal thermal conduction.
Claims21
An insulating element with an optimized insulating value for bounding spaces to be thermally insulated for transport or packaging containers, comprising a plate-shaped substrate element made of a material having a low thermal conductivity, wherein the substrate element is provided with a metallic coating having an emissivity of <0.2 and a layer thickness of <80 nm, and wherein the substrate element comprises a plurality of substantially honeycombed, closed cavities in which the walls that define the cavities are provided with the metallic coating.
Dependencies are inferred from the claim text.