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US 9,543,283 B2Granted
Light emitting diode package and method for manufacturing same
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsHou-Te Lin, Fu-Hsiang Yeh, Chao-Hsiung Chang, Pin-Chuan Chen, Lung-Hsin Chen
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Abstract
An LED packaging includes a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface, an LED mounted on the top surface of the substrate, a zener diode received in the recess, and a reflecting layer formed in the recess and enclosing the zener diode therein.
Claims8
A light emitting diode (LED) packaging comprising:
- a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface;
- an LED mounted on the top surface of the substrate;
- a zener diode received in the recess;
- and
- a reflecting layer formed in the recess and the reflecting layer enclosing the zener diode therein;
- wherein the substrate comprises a first electrode, a second electrode, the second electrode is cuboidal and located at a corner of the substrate, the first electrode has an L-shaped configuration, the zener diode is arranged on the second electrode and electrically connects the first electrode and the second electrode.
3 more elements
Dependencies are inferred from the claim text.