Electrostatic chuck and method of manufacturing semiconductor device

A method of manufacturing a semiconductor device comprising:

• adsorbing a plurality of first semiconductor chips periodically arrayed at a first interval with use of a first substrate including an electrostatic chuck device, protective films being formed on surfaces of the plurality of first semiconductor chips respectively;
• reducing adsorbing force against a plurality of second semiconductor chips among the plurality of first semiconductor chips periodically located at a second interval that is larger than the first interval by controlling adsorbing force of the first substrate;
• picking up simultaneously the plurality of second semiconductor chips through the protective films against which the adsorbing force was reduced;
• adhering simultaneously the plurality of second semiconductor chips to a second substrate;
• and
• removing the protective films from the plurality of second semiconductor chips after adhering simultaneously the plurality of second semiconductor chips to the second substrate,
• wherein the electrostatic chuck device comprises:
• a plurality of non-overlapping and predefined adsorption areas formed on a surface of said electrostatic chuck device, each of said plurality of adsorption areas comprising a plurality of first electrodes and a plurality of second electrodes alternately provided, each of the plurality of adsorption areas adsorbing a single first semiconductor chip, the plurality of adsorption areas being periodically arrayed in a matrix at the first interval;
• a first wiring electrically coupling between the plurality of first electrodes in an identical absorption area, the plurality of first electrodes of one of the plurality of adsorption areas being electrically isolated from the plurality of first electrodes of other adsorption areas;
• a second wiring electrically coupling between the plurality of second electrodes in the identical adsorption area, the plurality of second electrodes of one of the plurality of adsorption areas being electrically isolated from the plurality of second electrodes of other adsorption areas;
• and
• a control portion configured to control an electrostatic attractive force of each of the plurality of adsorption areas independently of other adsorption areas by applying a positive voltage and a negative voltage respectively to the first wiring and the second wiring of each of the plurality of adsorption areas independently of other adsorption areas.