Auto-correction of malfunctioning thermal control element in a temperature control plate of a semiconductor substrate support assembly that includes deactivating the malfunctioning thermal control element and modifying a power level of at least one functioning thermal control element

A method for auto-correction of at least one malfunctioning thermal control element among an array of thermal control elements that are independently controllable and located in a temperature control plate of a substrate support assembly which supports a semiconductor substrate during processing thereof, the method comprising:

• detecting, by a control unit including a processor, that at least one thermal control element of the array of thermal control elements is malfunctioning;
• deactivating, by the control unit, the at least one malfunctioning thermal control element;
• and
• modifying, by the control unit, a power level of at least one functioning thermal control element in the temperature control plate to minimize impact of the malfunctioning thermal control element on the desired temperature output at the location of the at least one malfunctioning thermal control element,
• wherein the array includes at least 50 thermal control elements and the temperature control plate is located between a temperature controlled base plate and a dielectric layer containing at least one electrostatic clamping electrode.

A non-transitory computer readable storage medium, storing instructions, which when executed by a processor, performs a method of performing auto-correction for at least one malfunctioning thermal control element among an array of thermal control elements that are independently controllable and located in a temperature control plate of a substrate support assembly which supports a semiconductor substrate during processing thereof, the method comprising:

• detecting that at least one thermal control element of the array of thermal control elements is malfunctioning;
• deactivating the at least one malfunctioning thermal control element;
• and
• modifying a power level of at least one functioning thermal control element in the temperature control plate to minimize impact of the malfunctioning thermal control element on the desired temperature output at the location of the at least one malfunctioning thermal control element,
• wherein the at least one malfunctioning thermal control element is detected by performing electrical monitoring that senses an open circuit, a closed circuit, or an altered state of the at least one malfunctioning thermal control element.

A non-transitory computer readable storage medium, storing instructions, which when executed by a processor, performs a method of performing auto-correction for at least one malfunctioning thermal control element among an array of thermal control elements that are independently controllable and located in a temperature control plate of a substrate support assembly which supports a semiconductor substrate during processing thereof, the method comprising:

• detecting that at least one thermal control element of the array of thermal control elements is malfunctioning;
• deactivating the at least one malfunctioning thermal control element;
• and
• modifying a power level of at least one functioning thermal control element in the electrostatic chuck to minimize impact of the malfunctioning thermal control element on the desired temperature output at the location of the at least one malfunctioning thermal control element,
• wherein the array includes at least 50 thermal control elements and the temperature control plate is located between a temperature controlled base plate and a dielectric layer containing at least one electrostatic clamping electrode.

A method for auto-correction of at least one malfunctioning thermal control element among an array of thermal control elements that are independently controllable and located in a temperature control plate of a substrate support assembly which supports a semiconductor substrate during processing thereof, the method comprising:

• detecting, by a control unit including a processor, that at least one thermal control element of the array of thermal control elements is malfunctioning;
• deactivating, by the control unit, the at least one malfunctioning thermal control element;
• and
• maintaining, by the control unit, power levels of all functioning thermal control elements in the temperature control plate to minimize impact of the malfunctioning thermal control element on the desired temperature output at the location of the at least one malfunctioning thermal control element,
• wherein the at least one malfunctioning thermal control element is detected by performing electrical monitoring that senses an open circuit, a closed circuit, or an altered state of the at least one malfunctioning thermal control element.