Semiconductor device
AssigneesToyota Jidosha Kabushiki Kaisha, Denso Corporation
InventorsKeita Hatasa, Arata Harada, Daisuke Harada
Life of this patent
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Abstract
A semiconductor device includes a semiconductor module that has an electrode terminal projecting externally; a substrate that has a through hole or a cut-out for inserting the electrode terminal; and a guide member that is provided between the semiconductor module and the substrate and guides the electrode terminal in such a manner that the electrode terminal is inserted into the through hole or the cut-out. The guide member becomes out of contact with the electrode terminal after the electrode terminal is inserted into the through hole or the cut-out.
Claims14
A semiconductor device comprising:
- a semiconductor module that has an electrode terminal projecting externally;
- a substrate that has a through hole or a cut-out for inserting the electrode terminal;
- and a guide member that is provided between the semiconductor module and the substrate and guides the electrode terminal in such a manner that the electrode terminal is inserted into the through hole or the cut-out, wherein the guide member is not in contact with the electrode terminal after insertion of the electrode terminal is inserted into the through hole or the cut-out, wherein the guide member includes a plurality of members movable with respect to the substrate, before the electrode terminal is inserted into the through hole or the cut-out, the respective ones of the plurality of members move in predetermined directions and form the guiding part as a result of joining together, and after the electrode terminal is inserted into the through hole or the cut-out, the respective ones of the plurality of members move in directions opposite to the predetermined directions and move away from each other so that the guiding part becomes out of contact with the electrode terminal.
A semiconductor device comprising:
- a semiconductor module having an electrode terminal projecting externally;
- a substrate having a through hole or a cut-out configured to receive the electrode terminal;
- and a guide member provided between the semiconductor module and the substrate, the guide member being configured to guide the electrode terminal into the through hole or the cut-out by aligning the electrode terminal in a direction of an opening of the through hole or the cut-out in response to the electrode terminal being inserted into the through-hole or cut-out, and, the guide member is not in contact with the electrode terminal after insertion of the electrode terminal into the through hole or the cut-out;
- wherein the guide member includes a plurality of members movable with respect to the substrate, before the electrode terminal is inserted into the through hole or the cut-out, the respective ones of the plurality of members move in predetermined directions and form the guiding part as a result of joining together, and after the electrode terminal is inserted into the through hole or the cut-out, the respective ones of the plurality of members move in directions opposite to the predetermined directions and move away from each other so that the guiding part becomes out of contact with the electrode terminal.
Dependencies are inferred from the claim text.