Multilayer wiring board for an electronic device
AssigneeInvensas Corporation
InventorsTomoo Iijima, Yoshitaka Fukuoka
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Abstract
An electronic assembly is disclosed that includes a flexible insulating film, a semiconductor component that has a thickness of less than 50 micrometers, a conductive interconnect extending through the flexible insulating film, a second patterned metal wiring film adjacent, and a third patterned metal wiring film. The second patterned metal wiring film is electrically coupled with the third patterned metal wiring film through the conductive interconnect. The semiconductor component is coupled to the first patterned metal wiring film and at least one of the second patterned metal wiring film or the third patterned metal wiring film.
Claims19
An electronic assembly comprising:
- a flexible insulating film having a first major surface and a first patterned metal wiring film extending parallel to the first major surface;
- a semiconductor component positioned within the flexible insulating film and having a thickness of less than 50 micrometers;
- a conductive interconnect extending through the flexible insulating film;
- a second patterned metal wiring film adjacent a first external surface of the electronic assembly;
- and
- a third patterned metal wiring film adjacent a second external surface of the electronic assembly,
- wherein the second patterned metal wiring film is electrically coupled with the third patterned metal wiring film through the conductive interconnect,
- wherein the semiconductor component is coupled to the first patterned metal wiring film and at least one of the second patterned metal wiring film or the third patterned metal wiring film, and
- wherein the assembly includes a flexible portion and a rigid portion, the flexible portion including at least a portion of the flexible insulating film extending beyond the rigid portion of the assembly, and
- wherein the first patterned metal wiring film overlying the at least a portion of the flexible insulating film forms an external edge of the assembly and wherein the at least a portion of the first patterned metal wiring film extending beyond the rigid portion of the assembly is exposed.
An electronic assembly comprising:
- a first surface, an opposed second surface, and an edge surface extending at least partially between the first and second opposed surfaces;
- a first patterned metal wiring film extending parallel to the first surface of the assembly;
- a semiconductor component positioned within the flexible insulating film and having a thickness of less than 50 micrometers;
- a flexible insulating film having a first major surface parallel to the first surface and a second patterned metal wiring film, at least a portion of the flexible insulting film extending in a direction away from the edge surface of the assembly, and
- a plurality of conductive interconnects extending through the flexible insulating film,
- wherein the second patterned metal wiring film is electrically coupled with the first patterned metal wiring film through at least one of the plurality of conductive interconnects;
- and
- wherein the semiconductor component is coupled to the first patterned metal wiring film and the second patterned metal wiring film, and
- wherein the assembly includes a flexible portion and a rigid portion, the flexible portion including at least a portion of the flexible insulating film extending beyond the rigid portion of the assembly, and
- wherein the flexible insulating film has a free end, and the flexible portion of the assembly includes at least a portion of the free end of the flexible insulating film and the first patterned metal wiring film extending beyond the rigid portion of the assembly.
Dependencies are inferred from the claim text.