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US 9,521,752 B2Granted
Method of making an electronic device having a thin film resistor formed on an LCP solder mask and related devices
AssigneeHarris Corporation
InventorLouis Joseph Rendek, Jr.
Life of this patent
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Abstract
A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film resistor on the LCP solder mask and coupling the at least one LCP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings.
Claims9
A method of making an electronic device comprising:
- forming at least one circuit layer comprising a plurality of solder pads on a substrate having opposing first and second major surfaces;
- forming a plurality of liquid crystal polymer (LCP) solder masks each carried by a respective one of the first and second major surfaces of the substrate and each having opposing first and second major surfaces and a plurality of mask openings therein extending between the first and second major surfaces thereof;
- forming at least one thin film resistor directly on the first major surface of at least one of the plurality of LCP solder masks;
- and
- coupling the plurality of LCP solder masks to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the plurality of solder pads is aligned with the plurality of mask openings.
2 more elements
Dependencies are inferred from the claim text.