US 9,521,751 B2 · Weaved electrical components in a substrate package core

Abstract

A substrate package includes a woven fabric having electrically non-conductive strands woven between electrically conductive strands including wire strands, co-axial strands, and/or an inductor pattern of strands. The package may be formed by an inexpensive and high throughput process that first weaves the non-conductive strands (e.g., glass) between the conductive strands to form a circuit board pattern of conductive strands in a woven fabric. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planarized. Planarizing segments and exposes ends of the wire, co-axial, and inductor pattern strands. Since the conductive strands were formed integrally within the planarized woven fabric, the substrate has a high mechanical stability and provides conductor strand based electrical components built in situ in the substrate package.

Claims21

Dependent claims

A circuit board comprising:

a circuit board pattern including a non-conductive board pattern of non-conductive strands woven between a component pattern of conductive strands;
wherein the component pattern includes both of (a) co-axial strands having a dielectric material between a solid conductor material wire and an outer shield cylinder of conductor material surrounding the solid conductor material wire and (b) an inductor pattern of solid conductor material wires;
cured resin impregnated within the circuit board pattern;
a top planar surface of the circuit board pattern;
a bottom planar surface of the circuit board pattern;
a first plurality of contacts formed on the top planar surface and coupled to the solid conductor material wire and to the outer shield cylinder of conductor material of the co-axial strands;
and
a second plurality of contacts formed on the top planar surface and electrically coupled to the solid conductor material wires of the inductor pattern.

5 more elements

A system for computing comprising:

an integrated chip mounted on a substrate package, the a substrate package including:
a circuit board pattern including a non-conductive board pattern of non-conductive strands woven between a component pattern of conductive strands;
wherein the component pattern includes both of (a) co-axial strands having a dielectric material between a solid conductor material wire and an outer shield cylinder of conductor material surrounding the solid conductor material wire and (b) an inductor pattern of solid conductor material wires;
cured resin impregnated within the circuit board pattern;
a top planar surface of the circuit board pattern;
a bottom planar surface of the circuit board pattern;
a first plurality of contacts formed on the top planar surface and coupled to the solid conductor material wire and to the outer shield cylinder of conductor material of the co-axial strands;
and
a second plurality of contacts formed on the top planar surface and electrically coupled to the solid conductor material wires of the inductor pattern.

6 more elements

Dependencies are inferred from the claim text.

Weaved electrical components in a substrate package core

Life of this patent

Weaved electrical components in a substrate package core

Life of this patent

Abstract

Claims21