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US 9,521,749 B2Granted
Circuit substrate and electronic device
AssigneeCanon Kabushiki Kaisha
InventorsKoichi Odagaki, Shuichi Kato
Life of this patent
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AssigneeCanon Kabushiki Kaisha
InventorsKoichi Odagaki, Shuichi Kato
Estimating the term…
A circuit substrate which is capable of decreasing the possibility that the amount of solder in the overall mounting land is uneven and reducing formation of a solder void even when a mounting terminal has a large soldering area. An electronic component having the mounting terminal is mounted on the circuit substrate. A mounting land is connected to the mounting terminal of the electronic component by soldering, and the mounting land has a protruding portion of an insulating material formed so as to protrude from an outer side of the mounting land toward an inner side of the mounting land, and the protruding portion does not divide the mounting land into a plurality of areas.
A circuit substrate on which an electronic component having a mounting terminal and a signal terminal is mounted, comprising:
An electronic device having a circuit substrate on which an electronic component is mounted, the circuit substrate comprising a first mounting land configured to be connected to a mounting terminal of the electronic component by soldering and a second mounting land configured to be connected to a signal terminal of the electronic component by soldering,
Dependencies are inferred from the claim text.